崗位職責(zé)：(985、211院校）
1. Project management and execution
項(xiàng)目管理和執(zhí)行
2. New product process design and design tool confirm
新產(chǎn)品流程設(shè)計(jì)和設(shè)計(jì)資料確認(rèn)
3. Material prepare for new product build up
新產(chǎn)品開(kāi)發(fā)物料準(zhǔn)備
4. New product sample manufacture and trouble shooting
新產(chǎn)品樣品全流程制作和問(wèn)題解決
5.Dvelopment report summary and provide improvement suggestion for new product
新產(chǎn)品樣品開(kāi)發(fā)報(bào)告總結(jié)和提供改善建議
6.Lab equipment maintenance
實(shí)驗(yàn)室設(shè)備維護(hù)和保養(yǎng)
7. Innovate new process and technology develop for FPC product
FPC產(chǎn)品新流程和新技術(shù)開(kāi)發(fā)
8. Other work assigned by manager
經(jīng)理指派的其它工作
任職要求：
1.Bachelor's degree or above, major in chemistry，electronics or other related engineering course majors
本科及以上學(xué)歷（本科要求211或者985），化學(xué),電子及其它相關(guān)專(zhuān)業(yè) 2.2~3 years above FPC/PCB experience is preferred
2-3年FPC/PCB經(jīng)驗(yàn)優(yōu)先 3.Proficient in lab analysis such microscope, cross section, IM, SEM/EDS, FIB, FTIR, UV, etc.;
精通實(shí)驗(yàn)室分析方法，如顯微鏡，切片，IM, SEM/EDS, FIB, FTIR, UV等等
4.Statistic data analysis is required, Capable on statistic sofeware Minitab is preferred
要求數(shù)據(jù)分析能力，會(huì)數(shù)據(jù)分析軟件Minitab優(yōu)先 5. Laser drilling, plasma, Shadow, Copper plating, Dry film lamination Exposure, Etching, stripping, Fast lamination, ENIG, Sputtering and Coating experience is preferred.
有鐳射鉆孔，等離子清潔，黑影，電鍍銅，干膜壓合，曝光，顯影，蝕刻，去膜，快壓，ENIG，磁控濺鍍和涂布等經(jīng)驗(yàn)者優(yōu)先 6.Strong logical thinking ability and problem-solving ability
很強(qiáng)的邏輯思考能力和解決問(wèn)題能力 7.Team cooperation spirits and good organizing ability
團(tuán)隊(duì)合作精神和良好組織能力 8.Good communication and coodination skills
良好溝通和協(xié)作能力